1. 2. 3. material content data sheet sales product name ipb027n10n3 g issued 29. august 2013 ma# MA000801042 package pg-to263-3-2 weight* 1564.99 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 15.455 0.99 0.99 9875 9875 leadframe inorganic material phosphorus 7723-14-0 0.091 0.01 58 non noble metal iron 7439-89-6 0.304 0.02 194 non noble metal copper 7440-50-8 304.026 19.43 19.46 194266 194519 wire non noble metal aluminium 7429-90-5 10.857 0.69 0.69 6938 6938 encapsulation organic material carbon black 1333-86-4 10.030 0.64 6409 plastics epoxy resin - 110.330 7.05 70498 inorganic material silicondioxide 60676-86-0 548.305 35.03 42.72 350359 427264 leadfinish non noble metal tin 7440-31-5 9.657 0.62 0.62 6170 6170 plating non noble metal nickel 7440-02-0 0.228 0.01 146 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 146 solder non noble metal tin 7440-31-5 0.147 0.01 94 noble metal silver 7440-22-4 0.183 0.01 117 non noble metal lead 7439-92-1 7.001 0.45 0.47 4474 4684 heatspreader inorganic material phosphorus 7723-14-0 0.165 0.01 105 non noble metal iron 7439-89-6 0.548 0.04 350 non noble metal copper 7440-50-8 547.666 34.99 35.04 349947 350403 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
